CL1608 Multilayer Chip Inductors - Compact EMI Suppression Solutions

High-density, low-crosstalk chip inductors engineered for communication devices, industrial systems, AI applications, and consumer electronics with stable impedance performance.

Multilayer Chip Inductors - CL1608 - Multilayer Chip Inductors
  • Multilayer Chip Inductors - CL1608 - Multilayer Chip Inductors

Multilayer Chip Inductors - CL1608

CL1608 (0603)

CL1608 delivers compact, stable‑impedance EMI suppression with low crosstalk, ideal for high‑density circuits in portable and communication devices.

Inductance / Impedance

0.047-10 (µH)

Rated Current

15-50 (mA)

Features
  • High mounting density of compact circuit due to crosstalk elimination that results from a closed magnetic flux in a ferrite material.
  • Suitable for flow and re-flow soldering.
  • Available in 3 sizes.
Applications
  • Industrial systems.
  • Power modules.
  • Communication devices.
  • AI systems.
  • Various categories of consumer electronics.
Dimensions (UNIT: mm)

A 1.6 ± 0.15 m/m
B 0.8 ± 0.15 m/m
C 0.8 ± 0.15 m/m
D 0.3 ± 0.20 m/m

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Customized inductor, choke, coil, and ferrite core.

How can you eliminate crosstalk interference in high-density circuit designs without compromising component size?

The CL1608 multilayer chip inductor solves this critical challenge with its ferrite core closed magnetic flux design, delivering exceptional EMI suppression in an ultra-compact footprint. Available in three sizes with inductance ratings from 0.047-10 ”H, it's specifically engineered for communication devices requiring high mounting density. Core Master's 40+ years of expertise ensures your communication equipment achieves superior signal integrity while maintaining design flexibility. Request a technical consultation to explore how CL1608 inductors can optimize your next-generation communication device.

Core Master's CL1608 delivers proven reliability through RoHS certification and SGS quality assurance, backed by over 40 years of inductor manufacturing expertise. The component's compatibility with flow and reflow soldering processes ensures seamless integration into modern manufacturing workflows, while its closed magnetic flux architecture eliminates the electromagnetic interference challenges that plague high-density designs. Whether your application demands compact form factors for consumer electronics, robust performance for communication infrastructure, or specialized solutions for AI systems and power modules, the CL1608 provides the stable-impedance EMI suppression your circuits require. Contact Core Master's engineering team today to explore customization options and technical specifications tailored to your specific application requirements.