Professional Multilayer High Current Chip Inductors for Advanced Electronics

Core Master delivers CL2016C multilayer inductors engineered for high-performance computer motherboards, I/O interfaces, and consumer electronics with superior EMC performance and compact circuit density.

Multilayer High Current Chip Inductors - CL2016C - Multilayer High Current Chip Inductors
  • Multilayer High Current Chip Inductors - CL2016C - Multilayer High Current Chip Inductors

Multilayer High Current Chip Inductors - CL2016C

CL2016C (0806)

CL2016C offers strong wideband impedance and crosstalk elimination, enhancing EMC performance in computer motherboards and high‑current I/O interfaces.

Inductance / Impedance

0.47-4.7 (µH)

Rated Current

1.1-1.5 (A)

Features
  • High mounting density of compact circuit due to crosstalk elimination that results from a closed magnetic flux in a ferrite material.
  • Suitable for flow and re-flow soldering.
  • Available in 3 sizes.
Applications
  • Computer motherboards.
  • I/O interfaces.
  • Various categories of consumer electronics.
Dimensions (UNIT: mm)

A 2.00 ± 0.20 m/m
B 1.60 ± 0.20 m/m
C 1.00 (MAX) m/m
D 0.70 (MAX) m/m

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Customized inductor, choke, coil, and ferrite core.

How can you achieve higher component density without compromising EMC performance in modern motherboard designs?

Core Master's CL2016C multilayer high current chip inductors solve this challenge through advanced ferrite core technology that provides closed magnetic flux design, enabling crosstalk elimination and strong wideband impedance performance. With three available sizes and ratings from 0.47-4.7 ”H, these inductors deliver the compact high-density mounting solutions your motherboard designs demand while maintaining superior electromagnetic compatibility—all backed by RoHS certification and 40+ years of manufacturing expertise.

Core Master's CL2016C multilayer inductors are engineered to address the critical challenge of electromagnetic interference in high-speed, high-current applications while maintaining the compact form factors demanded by today's electronics manufacturers. The crosstalk elimination capability—achieved through the ferrite material's magnetic flux containment—enables designers to achieve higher component density without sacrificing signal integrity or EMC compliance. Whether you're developing next-generation motherboards, complex I/O interface modules, or consumer electronics requiring robust power distribution and signal integrity, Core Master provides the technical expertise, customization capabilities, and proven manufacturing reliability to support your project from prototype through full-scale production. Contact our engineering team today to discuss your specific inductor requirements and discover how Core Master's CL2016C solutions can enhance your product's performance and reliability.