Wire Wound Ceramic Chip Inductors | Core Master
Ultra-compact WHI0402 ceramic chip inductors deliver high-Q EMI suppression for RF circuits. 1-120nH inductance, 30-1360mA rated current. RoHS certified.
Wire Wound Ceramic Chip Inductors - WHI0402
WHI0402
WHI0402 delivers ultraâcompact, highâQ EMI suppression for RF circuits, conserving PCB space while ensuring stable, highâfrequency performance.
Inductance / Impedance
1-120 (nH)
Rated Current
30-1360 (mA)
Features
- Their ceramic construction delivers the highest possible SRFâs and Q value.
- These ultra-compact inductors provided exceptional Q values, even at high.
- The non-magnetic coil form also assures the utmost in thermal stability, predictability and batch consistency.
Applications
- RF devices.
- Telecommunications equipment.
- Networking systems.
Dimensions (UNIT: mm)
A 1.19 (MAX) m/m
B 0.64 (MAX) m/m
C 0.66 (MAX) m/m
D 0.56 (REF) m/m
E 0.23 (REF) m/m
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How can you minimize PCB space while maintaining exceptional RF circuit performance and stability?
The WHI0402 ceramic chip inductor solves this critical challenge with ultra-compact dimensions and non-magnetic construction that delivers the highest possible SRF and Q values. Core Master's 40+ years of RF inductor expertise ensures your circuits achieve optimal performance with superior thermal stability and batch consistency. Contact our engineering team today to discuss how the WHI0402 can enhance your RF circuit design while reducing PCB footprint.
Core Master's 40+ years of inductor manufacturing expertise ensures the WHI0402 meets the highest quality standards with RoHS certification and SGS quality assurance. Whether you require standard specifications or fully customized solutions, our professional engineering team provides comprehensive technical support to optimize your RF circuit performance. The WHI0402's ultra-compact dimensions combined with stable high-frequency performance make it the preferred choice for OEMs and electronics manufacturers seeking dependable EMI suppression solutions without compromising circuit design flexibility or production timelines.