Large Current Multilayer Chip Beads - LCB1608
LCB1608 (0603)
LCB1608 delivers ultraâcompact, lowâDCR EMI suppression with highâcurrent capacity, ideal for dense PCB layouts in portable and consumer electronics.
Inductance / Impedance
10-600 (Ω)
Rated Current
1-4 (A)
Features
- Low DCR, small package.
- High current handling capacity.
- Nickel barrier terminations provide excellent solder heat resistance.
- Suitable for flow and reflow soldering and high current applications.
Applications
- I/O interfaces.
- Computer motherboards.
- Various categories of consumer electronics.
A 1.6 ± 0.2 m/m
B 0.8 ± 0.2 m/m
C 0.8 ± 0.2 m/m
D 0.3 ± 0.2 m/m
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CB1608 (0603)
CB1608 provides balanced midâ to highâfrequency noise attenuation with solid current capacity,...
Details
How can you reduce PCB board size while maintaining robust EMI suppression and high current capacity in motherboard I/O interfaces?
The LCB1608 multilayer chip beads solve this challenge with ultra-compact dimensions (1.6 à 0.8 à 0.8mm) combined with 1-4A current capacity and low DCR performance. Core Master's engineering team can customize inductance values (10-600Ω) to match your specific motherboard design requirements, enabling denser PCB layouts without sacrificing electromagnetic compatibility or reliability. Contact us for technical consultation on your next motherboard project.
Core Master's LCB1608 beads excel in high-current applications across I/O interfaces, computer motherboards, and various consumer electronics categories. The combination of small package size, low DCR characteristics, and robust current handling capacity makes this solution particularly valuable for manufacturers seeking to optimize board density without compromising electromagnetic compatibility. With over 40 years of specialized manufacturing experience and RoHS certification backed by SGS quality reports, Core Master ensures consistent product quality and reliable delivery for your most demanding applications.


