LCB2012 Chip Beads | Core Master High Current Inductors
LCB2012 multilayer chip beads deliver efficient power line noise filtering with excellent heat resistance for computer and communication systems.
Large Current Multilayer Chip Beads - LCB2012
LCB2012 (0805)
LCB2012 offers efficient power line noise filtering with excellent heat resistance, ensuring stable performance in computer and communication systems.
Inductance / Impedance
11-1000 (Ω)
Rated Current
1-6 (A)
Features
- Low DCR, small package.
- High current handling capacity.
- Nickel barrier terminations provide excellent solder heat resistance.
- Suitable for flow and reflow soldering and high current applications.
Applications
- I/O interfaces.
- Computer motherboards.
- Various categories of consumer electronics.
Dimensions (UNIT: mm)
A 2.0 ± 0.20 m/m
B 1.2 ± 0.20 m/m
C 0.9 ± 0.20 m/m
D 0.5 ± 0.3 m/m
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How can you reduce EMI noise in high-density motherboard designs while maintaining compact PCB layouts?
The LCB2012 multilayer chip beads solve this challenge with their compact 2.0 à 1.2 à 0.9mm package and exceptional low DCR characteristics, enabling efficient power line noise filtering without sacrificing board space. With current handling up to 6A and proven solder heat resistance, these components integrate seamlessly into modern motherboard manufacturing processes. Our engineering team can customize inductance values (11-1000Ω) to precisely match your circuit requirements.
Core Master's LCB2012 multilayer chip beads incorporate advanced ferrite core technology that ensures stable performance under thermal stress and electrical load variations. The component's small package dimensions (2.0 Ă 1.2 Ă 0.9mm) combined with high current handling capacity make it an optimal choice for space-constrained applications requiring robust EMI suppression. Backed by RoHS certification and SGS quality assurance, the LCB2012 delivers the reliability and consistency that global manufacturers demand. Contact our engineering team today to discuss customized specifications for your specific application requirements and benefit from our competitive pricing and reliable lead times.