Large Current Multilayer Chip Beads LCB4516 | Core Master
Core Master's LCB4516 multilayer chip beads deliver robust noise suppression for high-current circuits. Low DCR, 2-6A rated current, ideal for motherboards and industrial applications.
Large Current Multilayer Chip Beads - LCB4516
LCB4516 (1806)
LCB4516 ensures robust noise suppression for heavy‑load circuits, supporting stable operation in demanding industrial and I/O interface applications.
Inductance / Impedance
60-470 (Ω)
Rated Current
2-6 (A)
Features
- Low DCR, small package.
- High current handling capacity.
- Nickel barrier terminations provide excellent solder heat resistance.
- Suitable for flow and reflow soldering and high current applications.
Applications
- I/O interfaces.
- Computer motherboards.
- Various categories of consumer electronics.
Dimensions (UNIT: mm)
A 4.5 ± 0.2 m/m
B 1.6 ± 0.2 m/m
C 1.6 ± 0.2 m/m
D 0.5 ± 0.3 m/m
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Details
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How can you ensure stable power delivery and EMI suppression in high-density motherboard designs without compromising board space?
Core Master's LCB4516 multilayer chip beads solve this challenge with compact packaging, exceptional current handling (2-6A), and low DCR performance. Our beads are proven in leading motherboard applications and backed by 40 years of expertise. Request a technical consultation to optimize your circuit design and improve electromagnetic compatibility while reducing PCB footprint requirements.
Core Master's 40 years of specialized expertise in passive component manufacturing is reflected in the LCB4516's superior performance characteristics and reliability. These high-current handling multilayer chip beads are ideal for computer motherboards, I/O interface applications, and various consumer electronics requiring dependable noise suppression in heavy-load circuits. With RoHS certification and SGS quality assurance backing every unit, the LCB4516 delivers the consistent quality and technical support that B2B manufacturers demand. Contact Core Master's professional engineering team today to discuss how these advanced multilayer chip beads can optimize your circuit design, improve electromagnetic compatibility, and enhance overall system stability in your next generation of electronic products.